High Precision UV Precise Laser Cutting Machine for Sapphires (ASIDA-JG16B)

Model NO.
Laser Technology
Laser Vapor Cutting
High Precision
Transport Package
Wooden Carton
Pico laser
Our business aims to operating faithfully, serving to all of our clients , and working in new technology and new machine continuously for High Precision UV Precise Laser Cutting Machine for Sapphires (ASIDA-JG16B), The product will supply to all over the world, such as: Hamburg, Curacao, Malta, Our company abides by the management idea of "keep innovation, pursue excellence". On the basis of assuring the advantages of existing merchandise, we continuously strengthen and extend product development. Our company insists on innovation to promote the sustainable development of enterprise, and make us become the domestic high-quality suppliers.
Guangdong Zhengye Technology Co., Ltd. Diamond / Audited Supplier
PICO Laser cutting machine, ASIDA-JG16B
Specifications of Pico Laser Cutting Machine JG16B
Item Specifications
Laser source UV pico laser
wavelength 355nm
Pulse width 10ps
Frequency Range 1Hz ~ 2 MHz
Laser power 16W @ 400kHz
Single pulse energy > 200μJ
Laser frequency 400 kHz to 1000 kHz
Galvanometer maximum scanning speed 3000mm / s
Maximum scan range 50mm × 50mm
Focus spot 20 ± 5 μm
Maximum processing format 650mm × 550mm, single-head dual platform
Worktable XY axis movement maximum speed 800mm / s
Worktable XY axis positioning accuracy ± 3 μm
Worktable XY axis repeat positioning accuracy ± 1 μm
Processing Accuracy ± 20μm
Cutting material FPC, CVL, FPC micro-connection, ceramics, silicon and so on
Cutting material thickness 0.012 mm to 1.0 mm
File format * .gbr & * .dxf & * .lay
Power and power AC220V 50Hz / 2.5kW; AC380V 50Hz / 5.5kW
Dimensions Length × width × height = 2200mm × 2150mm × 1750mm (excluding 3 color lights)
Weight 3000Kg
Environment temperature 20 ° C ± 2 ° C
Environment humidity ≤ 60% RH, non-condensing Non-condensing
Equipment gas source 0.4-0.6MPa
Ground amplitude ≤ 5μm
Ground pressure 2000kgf /m2